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Last submissions
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Quy-Dong To, Qi-Chang He, Michel Cossavella, Karine Morcant, Adrian Panait. Stress analysis of the adhesive resin layer in a reinforced pin-loaded joint used in glass structures. International Journal of Adhesion and Adhesives, 2009, 29 (1), pp.91-97. ⟨10.1016/j.ijadhadh.2008.01.008⟩. ⟨hal-00733151⟩
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